SERIZAWA SEIICHI has a total of 13 patent applications. Its first patent ever was published in 1976. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors and machines are STRATEDGE CORP, STS SEMICONDUCTOR & TELECOMM CO LTD and TAKAI TOSHIO.
# | Country | Total Patents | |
---|---|---|---|
#1 | Japan | 13 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machines |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Unspecified technologies |
# | Name | Total Patents |
---|---|---|
#1 | Serizawa Seiichi | 13 |
#2 | Igawa Masahiro | 11 |
#3 | Takasaki Takaharu | 7 |
#4 | Maeda Atsushi | 1 |
Publication | Filing date | Title |
---|---|---|
JPH11214561A | Print wiring board | |
JPH11186483A | Lead frame for semiconductor device | |
JPH11111909A | Lead frame for semiconductor device | |
JPH1068097A | Electronic part | |
JPH09232493A | Lead frame | |
JPH09275182A | Lead frame for semiconductor device | |
JPH09172237A | Printed wiring board | |
JPH09172236A | Printed-wiring board | |
JPH06163735A | Package for semiconductor | |
JPH06163608A | Semiconductor package | |
JPH06163609A | Semiconductor package | |
JPH06120394A | Lead frame | |
JPS52128844A | Gold plating solution |