| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 7 | |
| #2 | United States | 7 | |
| #3 | WIPO (World Intellectual Property Organization) | 4 | |
| #4 | EPO (European Patent Office) | 2 | |
| #5 | Canada | 1 | |
| #6 | Japan | 1 | |
| #7 | Republic of Korea | 1 | |
| #8 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Audio-visual technology | |
| #4 | Optics |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Casings and printed circuits | |
| #4 | Nonlinear optics |
| # | Name | Total Patents |
|---|---|---|
| #1 | Zimmerman Michael | 9 |
| #2 | Zimmerman Michael A | 7 |
| #3 | Portuondo Maria M | 3 |
| #4 | Michael Zimmerman | 3 |
| #5 | Crane Stanford W Jr | 2 |
| #6 | Crane Jr Stanford W | 2 |
| #7 | Smith Keith | 2 |
| #8 | Shverdin Jacob | 2 |
| #9 | Jonathan Harris | 1 |
| #10 | Harris Jonathan | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2008073485A2 | Plastic electronic component package | |
| EP2089914A2 | Led reflective package | |
| CN101641785A | Microcircuit package having ductile layer |