AEGIS INC has a total of 16 patent applications. Its first patent ever was published in 1984. It filed its patents most often in United States, Australia and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, machines and audio-visual technology are QUANTUM LEAP PACKAGING INC, NCHIP INC and MAKI HIROSHI.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 5 | |
#2 | Australia | 3 | |
#3 | WIPO (World Intellectual Property Organization) | 3 | |
#4 | EPO (European Patent Office) | 2 | |
#5 | Denmark | 1 | |
#6 | Finland | 1 | |
#7 | Norway | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machines | |
#3 | Audio-visual technology |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Unspecified technologies | |
#3 | Casings and printed circuits |
# | Name | Total Patents |
---|---|---|
#1 | Scherer Jeremy D | 14 |
#2 | Baird Phillips | 7 |
#3 | Greenspan Jay S | 2 |
#4 | Medeiros Iii Manuel | 2 |
#5 | Tower Steven A | 1 |
#6 | Baird Philips | 1 |
Publication | Filing date | Title |
---|---|---|
US5188985A | Surface mount device with high thermal conductivity | |
US5111277A | Surface mount device with high thermal conductivity | |
AU2538188A | Microcircuit package with corrosion resistant pins and method of making | |
DK669687A | Corrosion resistant to metal covered micro circuits | |
WO8706765A1 | Corrosion resistant pins for metal packaged microcircuits | |
US4768077A | Lead frame having non-conductive tie-bar for use in integrated circuit packages | |
US4649229A | All metal flat package for microcircuitry | |
US4633573A | Microcircuit package and sealing method |