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SINHA NISHANT

Overview
  • Total Patents
    31
  • GoodIP Patent Rank
    235,437
  • Filing trend
    ⇩ 100.0%
About

SINHA NISHANT has a total of 31 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2006. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, chemical engineering and computer technology are ABOU-KHALIL MICHEL J, LAM RES AG and GLOBALFOUNDRIES INC.

Patent filings in countries

World map showing SINHA NISHANTs patent filings in countries
# Country Total Patents
#1 United States 31

Patent filings per year

Chart showing SINHA NISHANTs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sinha Nishant 31
#2 Sandhu Gurtej S 5
#3 Smythe John 5
#4 Sandhu Gurtej 3
#5 Wang Chao 2
#6 Greeley Neil 2
#7 Greeley J Neil 2
#8 Parat Krishna K 2
#9 Fishburn Fred D 1
#10 Kramer Steve 1

Latest patents

Publication Filing date Title
US10119825B1 System and method for geocoding positional accuracy
US2012326221A1 Multi-tiered semiconductor devices and associated methods
US2012011492A1 Systems and methods for concurrency analysis
US2011078511A1 Precise thread-modular summarization of concurrent programs
US2010281306A1 Modular bug detection with inertial refinement
US2010313907A1 Method for contamination removal using magnetic particles
US2010230724A1 Methods for forming three-dimensional memory devices, and related structures
US2009281999A1 Symbolic program analysis using term rewriting and generalization
US2010025854A1 Polishing systems and methods for removing conductive material from microelectronic substrates
US2010003782A1 Methods of forming a non-volatile resistive oxide memory cell and methods of forming a non-volatile resistive oxide memory array
US2009275208A1 Methods of removing silicon dioxide
US2009253271A1 Spin-on film processing using acoustic radiation pressure
US2009090692A1 Methods of processing substrates and methods of forming conductive connections to substrates
US2009074950A1 Methods of forming charge-trapping regions
US2009042401A1 Methods for substantially equalizing rates at which material is removed over an area of a structure or film that includes recesses or crevices