LEE KEVIN J has a total of 12 patent applications. Its first patent ever was published in 2005. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, machine tools and machines are LEE HO-JIN, CHIN MEITO and MQSEMI AG.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 12 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machine tools | |
#3 | Machines | |
#4 | Mechanical elements | |
#5 | Weapons | |
#6 | Computer technology | |
#7 | Biotechnology |
# | Name | Total Patents |
---|---|---|
#1 | Lee Kevin J | 12 |
#2 | Yeoh Andrew W | 2 |
#3 | Berry Tony James | 2 |
#4 | Pelto Christopher M | 2 |
#5 | Ma Hang-Shing | 2 |
#6 | Kothari Hiten | 2 |
#7 | Sattiraju Seshu V | 2 |
#8 | Bohr Mark T | 2 |
#9 | Kandas Angelo | 1 |
#10 | Joshi Subhash | 1 |
Publication | Filing date | Title |
---|---|---|
US2014077432A1 | Work holding device for an archery bow | |
US9489354B1 | Masking content while preserving layout of a webpage | |
US2012068342A1 | Electrically conductive adhesive for temporary bonding | |
US2011101192A1 | Multipurpose ball joint assembly and work holding devices | |
US2009166324A1 | Full-wafer backside marking process | |
US2008079166A1 | Managing forces of semiconductor device layers | |
US2008003715A1 | Tapered die-side bumps |