MICRO COMPONENTS LTD has a total of 24 patent applications. Its first patent ever was published in 1998. It filed its patents most often in WIPO (World Intellectual Property Organization), EPO (European Patent Office) and Australia. Its main competitors in its focus markets semiconductors, audio-visual technology and machines are CTS COMP TECHNOLOGY SYSTEM COR, ULTRATERA CORP and TAKADA KATSUMI.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 5 | |
#2 | EPO (European Patent Office) | 4 | |
#3 | Australia | 3 | |
#4 | China | 3 | |
#5 | United States | 3 | |
#6 | Canada | 2 | |
#7 | Israel | 2 | |
#8 | Republic of Korea | 2 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology | |
#3 | Machines | |
#4 | Surface technology and coating | |
#5 | Measurement | |
#6 | Electrical machinery and energy |
# | Name | Total Patents |
---|---|---|
#1 | Neftin Shimon | 20 |
#2 | Mirsky Uri | 20 |
#3 | Furer Lev | 9 |
#4 | Sezin Nina | 3 |
#5 | Dukhovny Leonid | 3 |
#6 | Lev Furer | 1 |
#7 | Uri Mirsky | 1 |
#8 | Leonid Mirsky Uri Neftin Shimo | 1 |
#9 | Shimon Neftin | 1 |
Publication | Filing date | Title |
---|---|---|
US2010252306A1 | Interconnect substrates, methods and systems thereof | |
IL190599D0 | Microelectronic interconnect substrate and packaging techniques | |
WO2008102332A1 | Optically monitoring an alox (tm) fabrication process | |
CN101584040A | Microelectronic intercionnect substrate and packaging techniques | |
KR20050085051A | Microelectronic packaging and components | |
IL127256D0 | Device for electronic packaging, a process for manufacturing thereof, and a pin jig fixture for use in the process | |
AU7447498A | Substrate for electronic packaging, pin jig fixture |