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ULTRATERA CORP

Overview
  • Total Patents
    96
About

ULTRATERA CORP has a total of 96 patent applications. Its first patent ever was published in 2000. It filed its patents most often in United States, Republic of Korea and China. Its main competitors in its focus markets semiconductors, audio-visual technology and surface technology and coating are TUOMINEN RISTO, AMITEC ADVANCED MULTILAYER INT and INAGAKI YASUSHI.

Patent filings in countries

World map showing ULTRATERA CORPs patent filings in countries

Patent filings per year

Chart showing ULTRATERA CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tsai Chung-Che 11
#2 Shan Wei-Heng 11
#3 Chih Wan-Kuo 10
#4 Tsai Shiann-Tsong 9
#5 Maa Chong-Ren 9
#6 Bai Jin-Chuan 8
#7 Su Huan-Ping 7
#8 Tsai Ming-Sung 7
#9 Bai Jin Chuan 6
#10 Xiancong Cai 5

Latest patents

Publication Filing date Title
CN101770961A Solder ball implanting method and solder ball implanting system applying solder ball implanting method
CN101764074A Semiconductor device and preparation method thereof
JP2009246337A Semiconductor device and method of manufacturing the same
CN101685804A Semiconductor wafer with self-adhesive protective layers
JP2009049404A Multi substrate block type package and its manufacturing method
CN101378050A Multi-substrate chunk type packaging piece and manufacturing method thereof
CN101431030A Method for producing semiconductor device
CN101325163A Memory card and manufacturing method thereof
US2005258544A1 Substrate for solder joint
US6933178B1 Method of manufacturing semiconductor packages and a clamping device for manufacturing a semiconductor package
CN1523952A Apparatus for fixing platy object or flaky object
TW556467B Device for fastening plate-like object or sheet-like object
EP1435765A1 Method of forming connections on a conductor pattern of a printed circuit board
US2003204949A1 Method of forming connections on a conductor pattern of a printed circuit board
TW573327B Plasma etching method
TW580848B Method of making connections on a conductor pattern of a PCB
CN1494131A Structure reinforced open window type semiconductor packaging unit
US6869824B2 Fabrication method of window-type ball grid array semiconductor package
EP1378295A2 Resin coated carrier fabrication method and the related apparatus for the fabrication
US6710434B1 Window-type semiconductor package and fabrication method thereof