| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 5 | |
| #2 | WIPO (World Intellectual Property Organization) | 3 | |
| #3 | EPO (European Patent Office) | 2 | |
| #4 | Canada | 1 | |
| #5 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Audio-visual technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Casings and printed circuits | |
| #4 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Larson Ralph I | 11 |
| #2 | Bird John | 2 |
| #3 | Dore North Lyne | 2 |
| #4 | Bussier Paul | 2 |
| #5 | Allen Amy Elise | 2 |
| #6 | Proulx Robert J | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2005053021A2 | Thermal interface and method of making the same | |
| WO03015488A1 | Electronics cooling subassembly | |
| US6827130B2 | Heatsink assembly and method of manufacturing the same | |
| US6339875B1 | Method for removing heat from an integrated circuit | |
| US5774336A | High-terminal conductivity circuit board | |
| US5687062A | High-thermal conductivity circuit board |