| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 3 | |
| #2 | United Kingdom | 2 | |
| #3 | Taiwan | 2 | |
| #4 | Germany | 1 | |
| #5 | France | 1 | |
| #6 | Japan | 1 | |
| #7 | Republic of Korea | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology | |
| #3 | Electrical machinery and energy | |
| #4 | Measurement | |
| #5 | Environmental technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Shen Ming-Tung | 7 |
| #2 | Senming-Tung | 1 |
| #3 | Chin Meito | 1 |
| #4 | Shen Ming-Dung | 1 |
| #5 | Ming Tung Shen | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US6501291B1 | Testing base for semiconductor devices | |
| KR20020014585A | Semiconductor Device and Contact-Forming Method Therefor | |
| TW455961B | Method for enabling semiconductor wafer to use liquid conductive material | |
| US6225691B1 | Integrated circuit packaging structure | |
| GB9913063D0 | Coupling terminals of a lead frame | |
| TW432650B | Semiconductor chip device and the manufacturing method thereof |