| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 6 | |
| #2 | EPO (European Patent Office) | 3 | |
| #3 | Israel | 3 | |
| #4 | Republic of Korea | 2 | |
| #5 | China | 1 | |
| #6 | Japan | 1 | |
| #7 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology | |
| #3 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Casings and printed circuits | |
| #3 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Igner Eva | 13 |
| #2 | Hurwitz Dror | 12 |
| #3 | Yofis Boris | 7 |
| #4 | Katz Dror | 7 |
| #5 | Statnikov Boris | 6 |
| #6 | Michaeli Benny | 6 |
| #7 | Zeidler Amit | 3 |
| #8 | Farkash Mordechay | 2 |
| #9 | Farkash Mordechai | 2 |
| #10 | Benny Michaeli | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2007289127A1 | Coreless cavity substrates for chip packaging and their fabrication | |
| US2007281471A1 | Advanced multilayer coreless support structures and method for their fabrication | |
| US6262478B1 | Electronic interconnect structure and method for manufacturing it | |
| IL128200D0 | Chip carrier substrate | |
| IL150672A | Chip carrier substrate | |
| EP1093163A2 | Electronic interconnect structure | |
| EP0867929A2 | Electronic interconnect structure and method for manufacturing it |