Learn more

FUJI KIKO DENSHI KK

Overview
  • Total Patents
    46
About

FUJI KIKO DENSHI KK has a total of 46 patent applications. Its first patent ever was published in 1976. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, audio-visual technology and materials and metallurgy are TAKADA KATSUMI, SHINDO DENSHI KOGYO KK and SHINKO ELECTRIC IND CO.

Patent filings in countries

World map showing FUJI KIKO DENSHI KKs patent filings in countries
# Country Total Patents
#1 Japan 46

Patent filings per year

Chart showing FUJI KIKO DENSHI KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sato Fumitaka 13
#2 Hojo Yoshihiro 9
#3 Hirakawa Tadashi 8
#4 Kamimura Tomoyuki 6
#5 Nagao Hideki 4
#6 Hojo Noriyuki 3
#7 Matsuoka Yoichi 3
#8 Yoshimura Eiji 3
#9 Takamatsu Susumu 2
#10 Houjiyou Yoshihiro 2

Latest patents

Publication Filing date Title
JP2010267985A Multilayer printed wiring board, method of inspecting the multilayer printed wiring board, system of inspecting the multilayer printed wiring board, and method of manufacturing the multilayer printed wiring board
JP2005123555A Printed wiring board, and its manufacturing method
JP2004095757A Laminated metal plate wiring board and its manufacturing method
JP2004095768A Multilayered wiring board and its manufacturing method
JP2004095772A Method of forming edge connector
JP2003179316A Structure of printed wiring board excellent in heat radiation property
JP2001168525A Manufacturing method of printed wiring board with end- surface through hole
JP2001024088A Printed board and method of partial plating thereof
JP2001015868A Circuit board, package, lead frame, and manufacture of it
JPH11135689A Radiating slug having cavity recess, its forming method, and semiconductor package material using the same
JPH10223802A External output bump of ball grid array semiconductor package and formation thereof
JPH1050884A Area grid array package
JPH09246418A Area-grid-array-package and its manufacturing method
JPH09232465A Printed wiring board for mounting semiconductor
JPH0964231A Board for area grid array package and its manufacture
JPH0946042A Circuit forming method in printed wiring board
JPH0936522A Formation of circuit of printed-wiring board
JPH0922962A Cavity-down ball grid array
JPH098175A Shelf formation method and bonding of multilayer printed-circuit board
JPH08192482A Different type material laminated plate and manufacture thereof