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ACCELERATED PRINTED CIRCUIT BOARD CO LTD

Overview
  • Total Patents
    25
  • GoodIP Patent Rank
    66,244
  • Filing trend
    ⇩ 37.0%
About

ACCELERATED PRINTED CIRCUIT BOARD CO LTD has a total of 25 patent applications. It decreased the IP activity by 37.0%. Its first patent ever was published in 2016. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, audio-visual technology and electrical machinery and energy are CITIZEN ELECTRON CO LTD, MIYOSHI ELECTRONICS CORP and CTS COMP TECHNOLOGY SYSTEM COR.

Patent filings in countries

World map showing ACCELERATED PRINTED CIRCUIT BOARD CO LTDs patent filings in countries
# Country Total Patents
#1 China 25

Patent filings per year

Chart showing ACCELERATED PRINTED CIRCUIT BOARD CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 He Zhongliang 24
#2 Shen Jie 10
#3 Ding Hua 7
#4 He Yutong 7
#5 Xu Guangze 7
#6 Shen Zheng 6
#7 Zhu Zhengming 6
#8 Guo Qiuwei 5
#9 Li Jinyang 5
#10 Zhang Xudong 4

Latest patents

Publication Filing date Title
CN111987086A High-contrast LED display module and packaging method
CN111885852A Preparation method of ceramic copper-clad plate
CN111668183A Lead frame for chip packaging and preparation method
CN111477733A Chip packaging method
CN110798985A Method for manufacturing refined film circuit board by using high-stability carrier
CN111836473A Strippable tin-copper transition layer, manufacturing method of tin-copper electrode and ultrathin copper foil
CN111863689A Package carrier, package and process thereof
CN111863633A Package carrier, package and process thereof
CN109930179A A kind of production method and its product of extra thin copper foil
CN111106018A Method for forming metal electrode in packaging process
CN111106056A Packaging carrier plate
CN110600382A Chip packaging process and product
CN110600439A RFID chip and manufacturing method thereof
CN110600458A LED lamp and manufacturing method thereof
CN108807192A A kind of IC package technique
CN107611077A A kind of IC package processing unit and processing method
CN107342354A A kind of IC package technique
CN107146774A A kind of IC package support plate and its packaging technology
CN106888551A A kind of ceramic base copper-clad plate and its preparation technology
CN106653624A Packaging technology for stabilizing chip