|
CN103711407A
|
|
Door and window
|
|
US2009244873A1
|
|
Method of mounting an optical device
|
|
US2009087949A1
|
|
Method of Making a Microelectronic Package Using an IHS Stiffener
|
|
US2008157345A1
|
|
Curved heat spreader design for electronic assemblies
|
|
US2008001268A1
|
|
Heat spreader as mechanical reinforcement for ultra-thin die
|
|
US2007158807A1
|
|
Edge interconnects for die stacking
|
|
US2007075420A1
|
|
Microelectronic package having direct contact heat spreader and method of manufacturing same
|
|
US2006286721A1
|
|
Breakable interconnects and structures formed thereby
|
|
US2006220223A1
|
|
Reactive nano-layer material for MEMS packaging
|
|
US2006138643A1
|
|
One step capillary underfill integration for semiconductor packages
|
|
US2005253282A1
|
|
Temperature resistant hermetic sealing formed at low temperatures for MEMS packages
|
