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APTOS CORP

Overview
  • Total Patents
    20
About

APTOS CORP has a total of 20 patent applications. Its first patent ever was published in 1999. It filed its patents most often in United States and Taiwan. Its main competitors in its focus markets semiconductors, audio-visual technology and micro-structure and nano-technology are ANAM SEMICONDUCTOR INC, SHIM IL KWON and PENDSE RAJENDRA D.

Patent filings in countries

World map showing APTOS CORPs patent filings in countries
# Country Total Patents
#1 United States 18
#2 Taiwan 2

Patent filings per year

Chart showing APTOS CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Tsing-Chow 9
#2 Lin Chang-Ming 3
#3 Wu Te-Sung 3
#4 Ho Chung W 2
#5 Ho Chi-Shen 2
#6 Lei Kuolung 2
#7 Lei Kuo Lung 2
#8 Ho Chi Shen 2
#9 Yeh Chi-Hone 1
#10 Chieh Erh-Kong 1

Latest patents

Publication Filing date Title
TW200629580A Sensor package structure, sensor packaging process, sensor module and fabricating method thereof
US2006063311A1 Wafer scale integration packaging and method of making and using the same
US2006001145A1 Wafer level mounting frame with passive components integration for ball grid array packaging
US2005224968A1 Wafer level mounting frame for ball grid array packaging, and method of making and using the same
US2005227412A1 Flexible multi-chip module and method of making the same
US2004256719A1 MEMS micro-cap wafer level chip scale package
US2004253801A1 Method of making an ultimate low dielectric device
US2004166662A1 MEMS wafer level chip scale package
US2004166661A1 Method for forming copper bump antioxidation surface
US2004137707A1 Flat-top bumping structure and preparation method
US2004134420A1 Apparatus and method for bubble-free application of a resin to a substrate
US6674173B1 Stacked paired die package and method of making the same
TW508780B Bumping process
US6635585B1 Method for forming patterned polyimide layer
US6316831B1 Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties
US6362087B1 Method for fabricating a microelectronic fabrication having formed therein a redistribution structure
US6448171B1 Microelectronic fabrication having formed therein terminal electrode structure providing enhanced passivation and enhanced bondability
US6281041B1 Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball