Embedded optical module packaging structure comprising a substrate, a top cover, a light-emitting chip, a light sensing chip and two packaging adhesive bodies, and capable of reducing the influence of side light
TW202038389A
Waterproof MEMS chip packaging structure has waterproof effect to improve the service life of product and simplify the packaging process
TW202038388A
Package structure of light sensing module which utilizes the collocation of first and second light blocking layers to omit the conventional light blocking elements of upper cover or shielding layer
TW201937664A
Package structure for pressure sensor including a package lead frame, a sidewall, a pressure sensing module and a package silicone
TW201929621A
Substrate structure and package module including a substrate and an annular bonding layer
TW201824588A
Packaging method of remote sensor with which the associativity of packaging material is better and the sensing distance is longer
TW201824524A
Package structure of optical module including a substrate, a light-emitting chip, a sensing chip, two encapsulants and a shielding layer
TW201824590A
Method for packaging remote sensor capable of providing excellent bonding capability and relatively long sensing distance
TW201823766A
Encapsulation structure of long-distance sensor and encapsulation method thereof which comprises a substrate, a light-emitting chip, a sensor chip, two encapsulation bodies, and a sealing cover
TW201824510A
Package structure of remote sensor, and package method thereof capable of performing a longer distance sensing operation with a higher measuring accuracy
TW201808025A
Microphone packaging structure comprising a substrate, an acoustic wave sensor, a processing chip, a sealing cover, a sound hole, at least one first welding pad and at least one second welding pad
TW201808022A
Microelectromechanical microphone packaging structure capable of providing multiple functions to satisfy specific user requirements
TW201808021A
MEMS microphone packaging structure comprises a substrate, a side wall, a lid plate, an acoustic wave transducer, and a processing module with more functions and cheaper cost
TW201808019A
Micro-electromechanical microphone packaging structure capable of improving the problems of signal interference and excessive I/O pins in conventional wire bonding process
TW201808020A
MEMS microphone package structure including a substrate, a sidewall, a cover plate, a processing chip, and an acoustic wave transducer
TW201620312A
Flip-type MEMS microphone
TW201616685A
Package structure for optical module and manufacturing method thereof
TW201616111A
Pressure sensor package structure
CN105575820A
Square-plane pin-free packaging structure and packaging method thereof
TW201613124A
Optical sensing module and method of manufacturing the same
