ADVANCED SEMICONDUCTOR ENG KOREA INC has a total of 15 patent applications. It decreased the IP activity by 42.0%. Its first patent ever was published in 2016. It filed its patents most often in United States and China. Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and telecommunications are AMKOR TECH SINGAPORE HOLDING PTE LTD, XINTEX INC and XINTEC INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 8 | |
#2 | China | 7 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Micro-structure and nano-technology | |
#3 | Telecommunications | |
#4 | Audio-visual technology | |
#5 | Optics | |
#6 | Measurement |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Microstructural devices | |
#3 | Making microstructural devices | |
#4 | Antennas | |
#5 | Optical systems | |
#6 | Measuring electric variables | |
#7 | Casings and printed circuits |
# | Name | Total Patents |
---|---|---|
#1 | Kim Seokbong | 5 |
#2 | Bae Soonheung | 4 |
#3 | Park Sunju | 3 |
#4 | Yang Junyoung | 3 |
#5 | Park Sangbae | 3 |
#6 | Yoon Hoguen | 2 |
#7 | Lee Yangwon | 2 |
#8 | Kim Hyunjoung | 2 |
#9 | Kim Dukyung | 2 |
#10 | Jin Hyoungjoon | 2 |
Publication | Filing date | Title |
---|---|---|
US2020075467A1 | Semiconductor device package | |
US2019057943A1 | Semiconductor package device and method of manufacturing the same | |
US2019035714A1 | Semiconductor package device and method of manufacturing the same | |
US2019031501A1 | Microelectromechanical systems and method of manufacturing the same | |
US2017359925A1 | Shield box, shield box assembly and apparatus for testing a semiconductor device | |
US2018315719A1 | Semiconductor package device and method of manufacturing the same | |
CN108227050A | Optical chip and its manufacturing method | |
US2018102325A1 | Semiconductor package device and method of manufacturing the same |