UNISEM M BERHAD has a total of 16 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2003. It filed its patents most often in United States, China and Taiwan. Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and audio-visual technology are TEH WENG HONG, KOJIMA AKIHIRO and CSMC TECHNOLOGIES FAB1 CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 11 | |
#2 | China | 2 | |
#3 | Taiwan | 2 | |
#4 | Malaysia | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Micro-structure and nano-technology | |
#3 | Audio-visual technology | |
#4 | Measurement |
# | Name | Total Patents |
---|---|---|
#1 | Wong Kwai Hong | 5 |
#2 | Chai Chan Wah | 4 |
#3 | Evans Alan | 4 |
#4 | Leung Timothy | 4 |
#5 | Tan Kim Heng | 4 |
#6 | Protheroe Rob | 4 |
#7 | Ming Xiang Tang | 3 |
#8 | Junhua Guan | 3 |
#9 | Tiong Mee Sing | 2 |
#10 | Low Andrew Wye Choong | 2 |
Publication | Filing date | Title |
---|---|---|
US2019259731A1 | Substrate based fan-out wafer level packaging | |
US2019181095A1 | Emi shielding for discrete integrated circuit packages | |
US2018130768A1 | Substrate Based Fan-Out Wafer Level Packaging | |
US2018130720A1 | Substrate Based Fan-Out Wafer Level Packaging | |
US2016276251A1 | Lead frames with wettable flanks | |
US2014246739A1 | Top port MEMS cavity package and method of manufacture thereof | |
US2014246738A1 | Top port MEMS cavity package and method of manufacture thereof | |
MY140980A | Semiconductor package |