Method for three-dimensional (3D) integration of e.g. chips mounted in printed circuit board, involves patterning composite layer prior to lamination, and performing gluing or melting by laser or by cutting or punching process
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Method and assembly for producing a semiconductor module
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Producing a semiconductor module having two semiconductor chips and an interposer, which has electrically conductive structures, comprises imprinting the interposer directly on first one of the semiconductor chips
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Carrying device for a sanitary object
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Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangement
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Wafer treatment, involves coating front side of wafer with layer with separation properties and carrier layer, where carrier layer exhibits electrostatic properties and includes elastomer layer or hard layer of polyimide
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Wafer treatment involves presenting components during thinning of wafer, separation of components and intermediate production steps, where front of wafer is coated with layer or layer system comprising interface and carrier layer
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Process for treating wafers comprises covering the front side of the wafer having components with a layer system consisting of a separating layer and a protective layer before the rear side of the wafer is coated
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Internal spacing bar of gas-filled insulated multi-panel glazing
