ZIPTRONIX INC has a total of 121 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 1999. It filed its patents most often in United States, Japan and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, machines and machine tools are GEN SEMICONDUCTOR OF TAIWAN LT, LIN MOU-SHIUNG and YANG CHIH-CHAO.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 43 | |
#2 | Japan | 14 | |
#3 | EPO (European Patent Office) | 10 | |
#4 | Republic of Korea | 9 | |
#5 | Taiwan | 9 | |
#6 | WIPO (World Intellectual Property Organization) | 9 | |
#7 | China | 8 | |
#8 | Canada | 7 | |
#9 | Israel | 7 | |
#10 | Australia | 3 | |
#11 | Singapore | 2 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machines | |
#3 | Machine tools | |
#4 | Surface technology and coating | |
#5 | Micro-structure and nano-technology | |
#6 | Environmental technology |
# | Name | Total Patents |
---|---|---|
#1 | Enquist Paul M | 84 |
#2 | Tong Qin-Yi | 58 |
#3 | Fountain Jr Gaius Gillman | 21 |
#4 | Fountain Gaius Gillman Jr | 13 |
#5 | Rose Anthony Scot | 10 |
#6 | Tong Qin Yi | 8 |
#7 | Paul M Engquist | 7 |
#8 | Paul M Enquist | 6 |
#9 | Petteway Carl T | 6 |
#10 | Fountain Gaius Gillman | 5 |
Publication | Filing date | Title |
---|---|---|
TW201417185A | Heterogeneous annealing method and device | |
US2007037379A1 | 3D IC method and device | |
US2006264004A1 | Method of detachable direct bonding at low temperatures | |
US2005194668A1 | Wafer scale die handling | |
US6867073B1 | Single mask via method and device | |
US2004235266A1 | Method of room temperature covalent bonding | |
US2004157407A1 | Method for room temperature metal direct bonding | |
US6563133B1 | Method of epitaxial-like wafer bonding at low temperature and bonded structure | |
US6500694B1 | Three dimensional device integration method and integrated device | |
US6902987B1 | Method for low temperature bonding and bonded structure | |
US6984571B1 | Three dimensional device integration method and integrated device |