HERAEUS ORIENTAL HITEC CO LTD has a total of 15 patent applications. Its first patent ever was published in 1998. It filed its patents most often in Republic of Korea, China and Singapore. Its main competitors in its focus markets semiconductors, materials and metallurgy and surface technology and coating are HERAEUS MATERIALS SINGAPORE PTE LTD, SHANGHAI WEISONG INDUSTRY AUTOMATION CO LTD and KULICKE & SOFFA IND INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | Republic of Korea | 11 | |
#2 | China | 1 | |
#3 | Singapore | 1 | |
#4 | Taiwan | 1 | |
#5 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Materials and metallurgy | |
#3 | Surface technology and coating | |
#4 | Machine tools | |
#5 | Packaging and shipping |
# | Name | Total Patents |
---|---|---|
#1 | Baek Jeong U | 5 |
#2 | Sarangapani Murali | 4 |
#3 | Cho Mong Hyun | 4 |
#4 | Kim Jong Su | 4 |
#5 | Jung Hyun Seok | 4 |
#6 | Cho Yeong Cheol | 4 |
#7 | Kang Il Tae | 4 |
#8 | Zhang Xi | 4 |
#9 | Kim Tae Yeop | 4 |
#10 | Chung Eun Kyun | 3 |
Publication | Filing date | Title |
---|---|---|
SG10201509634UA | Coated wire | |
KR20090095719A | Bonding Wire | |
KR100796570B1 | Gold alloy wire for bonding of semiconductor device | |
KR20050017733A | Spool for bonding wire and method for grounging the bonding wire | |
KR20040073667A | Bonding wire for semiconductor device | |
KR20030096985A | Gold alloy wire for bonding of semiconductor device | |
KR20030043311A | Gripper for spool, spool handling device with the gripper and method for handling the spool | |
KR20030035477A | Spool case for bonding wire and method for handling spool using the case | |
KR20030031256A | Spool case for bonding wire and method for handling spool using the case | |
KR20010018453A | Gold alloy wire for bonding of semiconductor device | |
KR20000040968A | Gold alloy thin wire for bonding |