| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 22 | |
| #2 | United States | 3 | |
| #3 | Singapore | 2 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machine tools | |
| #3 | Audio-visual technology | |
| #4 | Electrical machinery and energy | |
| #5 | Surface technology and coating |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Soldering, welding and flame cutting | |
| #3 | Casings and printed circuits | |
| #4 | Dynamo-electric machines | |
| #5 | Layered products |
| # | Name | Total Patents |
|---|---|---|
| #1 | Clauberg Horst | 7 |
| #2 | Wasserman Matthew B | 7 |
| #3 | Colosimo Jr | 5 |
| #4 | Deangelis Dominick A | 4 |
| #5 | Qin Wei | 4 |
| #6 | Chylak Robert N | 3 |
| #7 | Schmidt-Lange Michael P | 3 |
| #8 | Babinetz Stephen E | 3 |
| #9 | Shah Aashish | 3 |
| #10 | Ahmad Ziauddin | 3 |
| Publication | Filing date | Title |
|---|---|---|
| US2020006161A1 | Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine | |
| TW201903911A | Systems and Methods for Bonding Semiconductor Elements | |
| TW201836097A | Methods for ultrasonically bonding semiconductor elements |