KULICKE & SOFFA INVEST has a total of 20 patent applications. Its first patent ever was published in 1999. It filed its patents most often in China and United States. Its main competitors in its focus markets semiconductors, machine tools and machines are MINAMIO MASANORI, SHINKAWA KK and WESTCODE SEMICONDUCTORS LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | China | 19 | |
#2 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machine tools | |
#3 | Machines | |
#4 | Electrical machinery and energy | |
#5 | Chemical engineering |
# | Name | Total Patents |
---|---|---|
#1 | Norman Lucas | 2 |
#2 | Deepak Sood | 2 |
#3 | Jon Eder James E Brunner | 1 |
#4 | Rakesh Batish | 1 |
#5 | Dan Laurent Edward T Mironescu | 1 |
#6 | Batish Rakesh Hmiel Andrew F S | 1 |
#7 | Nikhil Murdeshwar | 1 |
#8 | Dan Mironescu | 1 |
#9 | Walt Batish Rakesh Kulicke C S | 1 |
#10 | Shunjun He | 1 |
Publication | Filing date | Title |
---|---|---|
CN101075572A | Device clamp, wire bonding machine and method for providng fluid to bonding area of wire bonding machine | |
CN101505904A | Improved Z-axis motion system for a wire bonding machine | |
CN1950934A | Integrated ball and via package and formation process | |
CN101014864A | Probe attach tool | |
CN1886226A | Low loop height ball bonding method and apparatus | |
US6321969B1 | Efficient energy transfer capillary | |
CN1553492A | Semiconductor copper bond pad surface protection |