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ORTHODYNE ELECTRONICS CORP

Overview
  • Total Patents
    71
  • GoodIP Patent Rank
    168,731
  • Filing trend
    ⇩ 50.0%
About

ORTHODYNE ELECTRONICS CORP has a total of 71 patent applications. It decreased the IP activity by 50.0%. Its first patent ever was published in 1981. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets semiconductors, machine tools and machines are SHANGHAI WEISONG INDUSTRY AUTOMATION CO LTD, KULICKE & SOFFA IND INC and F&K DELVOTEC BONDTECHNIK GMBH.

Patent filings in countries

World map showing ORTHODYNE ELECTRONICS CORPs patent filings in countries

Patent filings per year

Chart showing ORTHODYNE ELECTRONICS CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Copperthite Theodore J 17
#2 Byars Jonathan Michael 11
#3 Luechinger Christoph Benno 10
#4 Luechinger Christoph B 9
#5 Xu Tao 8
#6 Walker Todd J 7
#7 Babayan Vartan 6
#8 Wong Garrett Leigh 5
#9 Valentin Orlando Luis 5
#10 Byars Jonathan M 4

Latest patents

Publication Filing date Title
WO2017132027A1 Wedge bonding tools, wedge bonding systems, and related methods
US2017120372A1 Ribbon bonding tools, and methods of designing ribbon bonding tools
US2015017878A1 Systems and methods for processing solar substrates
US2014048584A1 Ultrasonic bonding systems and methods of using the same
DE102013201868A1 Wire bonding system useful for forming wire loop, comprises bonding head, bonding tool, wire supply formed for bonding using bonding tool, and wire shaping tool, which is independently movable with respect to bonding head and bonding tool
US2013200134A1 Wire loop forming systems and methods of using the same
CN103718281A Wire bonding tool
WO2012099771A1 Systems and methods for processing ribbon and wire in ultrasonic bonding systems
SG190962A1 Methods and systems for aligning tooling elements of ultrasonic bonding systems
WO2012012335A2 Ultrasonic bonding systems including workholder and ribbon feeding system
WO2011137269A2 Ultrasonic bonding systems and methods of using the same
CN102763207A Support system for a semiconductor device
CN102844851A Ultrasonic bonding systems and methods of using the same
CN102770950A Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations
WO2010096600A2 Systems and methods for processing solar substrates
CN105598573A Ribbon bonding tools and methods of using the same
WO2010090778A2 Cutting blade for a wire bonding system
WO2010057016A2 Semiconductor device support for bonding
US2008073407A1 Deep access large ribbon bond head
WO2006081106A1 Ribbon bonding tool and process