| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 5 | |
| #2 | China | 1 | |
| #3 | Germany | 1 | |
| #4 | Japan | 1 | |
| #5 | Republic of Korea | 1 | |
| #6 | Singapore | 1 | |
| #7 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machine tools | |
| #3 | Audio-visual technology | |
| #4 | Measurement | |
| #5 | Packaging and shipping |
| # | Name | Total Patents |
|---|---|---|
| #1 | Mattmueller Jan | 4 |
| #2 | Seidel Marit | 4 |
| #3 | Werne Dominik | 2 |
| #4 | Baumann Damian | 2 |
| #5 | Damian Baumann | 1 |
| #6 | Ruedi Grueter | 1 |
| #7 | Jan Mattmueller | 1 |
| #8 | Behler Stefan | 1 |
| #9 | Dominik Werne | 1 |
| #10 | Scholze Stephan | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN101517722A | Method and device for wetting the bumps of a semiconductor chip with soldering flux |