| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Singapore | 4 | |
| #2 | WIPO (World Intellectual Property Organization) | 4 | |
| #3 | Australia | 3 | |
| #4 | Malaysia | 3 | |
| #5 | China | 2 | |
| #6 | EPO (European Patent Office) | 2 | |
| #7 | Taiwan | 2 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machine tools | |
| #3 | Thermal processes |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Soldering, welding and flame cutting | |
| #3 | Details of furnaces |
| # | Name | Total Patents |
|---|---|---|
| #1 | Radeck Stephanie Elizabeth Ann | 9 |
| #2 | Gotsis Franz Michael Anastasiu | 7 |
| #3 | Stephanie Elisabeth Anna Radec | 4 |
| #4 | Radeck Stephanie Elisabeth Anna | 3 |
| #5 | Yu Feng | 3 |
| #6 | Franz Michael Anastasius Gotsi | 3 |
| #7 | Radeck Stephanie Elisabeth | 2 |
| #8 | Gotsis Franz Michael Anastasius | 2 |
| #9 | Tan Chin Hiang | 2 |
| #10 | Radeck Stephanie Elisabeth Ann | 1 |
| Publication | Filing date | Title |
|---|---|---|
| SG117410A1 | Method and apparatus for dispensing solder | |
| SG105504A1 | Die bonder and method for detecting misaligned workpieces | |
| SG91870A1 | Method and device for bleed out control in solder bonding | |
| SG91867A1 | Improved apparatus and method for dispensing solder |