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HERAEUS MATERIALS SINGAPORE PTE LTD

Overview
  • Total Patents
    88
  • GoodIP Patent Rank
    17,895
  • Filing trend
    ⇩ 87.0%
About

HERAEUS MATERIALS SINGAPORE PTE LTD has a total of 88 patent applications. It decreased the IP activity by 87.0%. Its first patent ever was published in 2013. It filed its patents most often in WIPO (World Intellectual Property Organization), Singapore and EPO (European Patent Office). Its main competitors in its focus markets materials and metallurgy, semiconductors and surface technology and coating are HERAEUS ORIENTAL HITEC CO LTD, LEE JUN-DER and TECHNI HOLDING AS.

Patent filings per year

Chart showing HERAEUS MATERIALS SINGAPORE PTE LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sarangapani Murali 52
#2 Zhang Xi 33
#3 Tok Chee Wei 18
#4 Pan Wei Chih 17
#5 Kang Il Tae 16
#6 Liao Jin Zhi 16
#7 Milke Eugen 16
#8 Kim Jong Su 15
#9 Jung Hyun Seok 15
#10 Kim Tae Yeop 15

Latest patents

Publication Filing date Title
EP3809807A1 Manufacturing and tape transfer method for a patteerned preform
WO2020218968A1 Coated wire
WO2020122809A1 Process for electrically connecting contact surfaces of electronic components
SG10201607523RA Coated wire
SG10201606515VA Process for electrically connecting the contact surfaces of electronic components by a bonding wire having an electrically insulating coating
SG10201600329SA Coated wire
SG10201510661RA Sputtering Target Of Ruthenium-Containing Alloy And Production Method Thereof
SG10201509913XA Silver alloyed copper wire
SG10201508103QA Alloyed silver wire
SG10201508104TA Alloyed silver wire
SG10201507167UA Co-Based Alloy Sputtering Target Having Boride and Method For Producing The Same
TW201542830A Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal
SG10201408586XA Corrosion and moisture resistant bonding wire
SG10201408302QA COATED COPPER (Cu) WIRE FOR BONDING APPLICATIONS
SG10201406685YA Metal sintering preparation and the use thereof for the connecting of components
SG10201402705VA Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal
SG10201401618YA Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal
KR20160013057A Copper bond wire and method of making the same
EP2930746A1 Copper bond wire and method of making the same
SG2013016415A Coated copper wire for bonding applications