HEDLER HARRY has a total of 18 patent applications. Its first patent ever was published in 2005. It filed its patents most often in United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, measurement and micro-structure and nano-technology are NISHIMURA TAKAO, AMKOR TECHNOLOGY INC and SANDISK SEMICONDUCTOR (SHANGHAI) CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 16 | |
#2 | WIPO (World Intellectual Property Organization) | 2 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Measurement | |
#3 | Micro-structure and nano-technology | |
#4 | Audio-visual technology | |
#5 | Machines | |
#6 | Computer technology | |
#7 | Environmental technology |
# | Name | Total Patents |
---|---|---|
#1 | Hedler Harry | 18 |
#2 | Irsigler Roland | 8 |
#3 | Zapf Joerg | 5 |
#4 | Meyer Thorsten | 4 |
#5 | Wirth Stefan | 3 |
#6 | Hughes Timothy | 2 |
#7 | Wolter Andreas | 2 |
#8 | Spahn Martin | 2 |
#9 | Weis Rolf | 1 |
#10 | Lehmann Legal Representative Judith | 1 |
Publication | Filing date | Title |
---|---|---|
US2009218690A1 | Reduced-stress through-chip feature and method of making the same | |
US2009212420A1 | integrated circuit device and method for fabricating same | |
US2008079149A1 | Circuit board arrangement and method for producing a circuit board arrangement | |
US2007084944A1 | Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stacking | |
US2007032059A1 | Method of manufacturing a semiconductor structure having a wafer through-contact and a corresponding semiconductor structure |