Learn more

HANA MICRON CO LTD

Overview
  • Total Patents
    155
About

HANA MICRON CO LTD has a total of 155 patent applications. Its first patent ever was published in 2002. It filed its patents most often in Republic of Korea, Brazil and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, computer technology and telecommunications are LEE HO-JIN, CHIN MEITO and MQSEMI AG.

Patent filings in countries

World map showing HANA MICRON CO LTDs patent filings in countries

Patent filings per year

Chart showing HANA MICRON CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Jeong Jin Wook 23
#2 Lee Hee Bong 17
#3 Ryu Ki Tae 13
#4 Lee Hyun Woo 13
#5 Choi Hyung Chul 12
#6 Kim Hyun Joo 10
#7 Hwang Chul Kyu 10
#8 Kim Dae Jin 10
#9 Seo Gyoo Sen 9
#10 Jung Yong Ha 8

Latest patents

Publication Filing date Title
KR20120098556A Stacked semiconductor package
KR20120088365A Stack semiconductor package and method of manufacturing the same
KR20120086146A Stepped-stacked semiconductor package and method of manufacturing the same
KR20120086144A Stepped-stacked semiconductor package and method of manufacturing the same
KR20120086142A LED Package Manufacturing Method
KR20120077872A A substrate embedding semiconductor chip and a semiconductor package having the substrate
KR20120077786A Semiconductor package and method of manufacturing the same
KR20120089962A A usb memory package
KR20120076811A Semiconductor package
KR20120073937A Led package manufacturing method
KR20120074019A Stack structure of semiconductor package and stack method for using the same
KR20120074014A Semiconductor package and method for using the same
KR20120072393A Stacked semiconductor package
KR20120072394A Stacked semiconductor package
KR20120071734A Semiconductor package and method for manufacturing the same
KR20120071916A Semiconductor package and method for manufacturing the same
KR20120057874A System in package with embedded antenna and mobile electronic device having the package
KR20120058173A Stack semiconductor package and method of manufacturing the same
KR20120058302A semiconductor package stacking method and stacked semiconductor package thereof
KR20120057330A Semiconductor chip package