FLIP CHIP TECHNOLOGIES L L C

Overview

About

FLIP CHIP TECHNOLOGIES L L C has a total of 15 patent applications. Its first patent ever was published in 1997. It filed its patents most often in WIPO (World Intellectual Property Organization), United States and China. Its main competitors in its focus markets semiconductors, audio-visual technology and computer technology are FLIPCHIP INTERNAT L L C, SAMSUNG SEMICONDUCTOR CN R&D and STS SC & TELECOMM CO LTD.

Patent filings in countries

#	Country	Total Patents
#1	WIPO (World Intellectual Property Organization)	7
#2	United States	5
#3	China	1
#4	EPO (European Patent Office)	1
#5	Taiwan	1

#	Technology
#1	Semiconductor devices
#2	Electric digital data processing
#3	Casings and printed circuits
#4	Soldering, welding and flame cutting
#5	Climate change mitigation in goods production
#6	Photomechanical semiconductor production

#	Name	Total Patents
#1	Elenius Peter	12
#2	Hollack Harry	4
#3	Johnson Michael E	3
#4	Kim Deok-Hoon	3
#5	Kim Deok Hoon	2
#6	Stepniak Dave Charles	2
#7	Ling Jamin	2
#8	Hoon Johnson Michael E Elenius	1
#9	Yang Hong	1
#10	Malmrose Roger	1

Publication	Filing date	Title
CN1906746A	2004-09-27	Wafer-level moat structures
US6445069B1	2001-01-22	Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor
US6578755B1	2000-09-22	Polymer collar for solder bumps
WO9848449A2	1998-04-21	Flip chip and chip scale package
US6441487B2	1997-10-20	Chip scale package using large ductile solder balls