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GUANGDONG QIPAI TECH CO LTD

Overview
  • Total Patents
    13
  • GoodIP Patent Rank
    126,865
About

GUANGDONG QIPAI TECH CO LTD has a total of 13 patent applications. Its first patent ever was published in 2018. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, audio-visual technology and telecommunications are ZYCUBE KK, OHKUCHI MATERIALS CO LTD and WALSIN ADVANCED ELECTRONICS.

Patent filings in countries

World map showing GUANGDONG QIPAI TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 13

Patent filings per year

Chart showing GUANGDONG QIPAI TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yang Jianwei 12
#2 Liang Dazhong 3
#3 Cheng Lang 2
#4 Zhang Yi 2
#5 Rao Xilin 2
#6 Huang Yiwei 1
#7 Yi Bingchuan 1
#8 Wen Zhengguo 1
#9 Si Yiping 1
#10 Cai Zexian 1

Latest patents

Publication Filing date Title
CN111863765A DFN or QFN lead frame and manufacturing method thereof
CN110783304A Packaging welding structure for solving high reliability requirement of 5G GaN chip welding
CN110690190A Packaging method and packaging structure for double-side welding assembly of lead frame
CN110323198A Contactless upper lower chip packaging structure and its packaging method
CN110429075A The exposed encapsulating structure of the more lateral leads of high density and its production method
CN110335855A A kind of chip-packaging structure improving welding cavity
CN110211942A A kind of the copper folder and chip-packaging structure of chip package
CN110137158A A kind of encapsulating method and structure of package module antenna
CN110164833A A kind of packaging method and chip package product of chip cooling piece
CN110071084A A kind of two-sided welding encapsulating products and its assemble method
CN109712948A A kind of chip-packaging structure of integrated passive device
CN109699129A Solve method and SMD component that SMD component crosses wave-soldering bridge
CN109494205A A kind of copper folder stack chip structure and its packaging method