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FLEXSCOM INC

Overview
  • Total Patents
    15
  • GoodIP Patent Rank
    114,271
  • Filing trend
    ⇧ 100.0%
About

FLEXSCOM INC has a total of 15 patent applications. It increased the IP activity by 100.0%. Its first patent ever was published in 2015. It filed its patents most often in Republic of Korea. Its main competitors in its focus markets semiconductors, computer technology and measurement are KITAMURA MASAHIRO, SHANGHAI HUALI MICROELECTRONIC and BECKER SCOTT T.

Patent filings in countries

World map showing FLEXSCOM INCs patent filings in countries
# Country Total Patents
#1 Republic of Korea 15

Patent filings per year

Chart showing FLEXSCOM INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Hyouk 15
#2 Jeong Jun Hee 12
#3 Kim Tae Won 7
#4 Yoo Min Goo 7
#5 Song Ki Hong 2

Latest patents

Publication Filing date Title
KR20200111389A Apparatus and method for transferring wafer using roller
KR20200065450A Apparatus and method for transferring wafer
KR20180083277A Flexible protection case to witch a flexible external memory is mounted
KR20190024304A Wafer support, and method and apparatus for transferring wafer using the same
KR20180037505A Flexible semiconductor package having reinforcing member
KR20170143341A Flexible protection case to witch a flexible external memory is mounted
KR20170143344A Connection structure of detachable multi connector
KR20170111080A Smart Watch Having Flexible Nand Flash Memory
KR101651272B1 Flexible semiconductor package with stress relief structure at interconnects using anisotropic conductive adhesive
KR20170029920A Flexible circuit board and semiconductor package having rigid dummy
KR20170029923A Hybrid semiconductor package controlling radius of curvature by adjusting rigidity of mold
KR20170029925A Flexible semiconductor package controlling curvature radius by using double mold
KR20170029922A Bi-directionally flexible semiconductor package of strip type
KR20170029921A Flexible semiconductor package having elastic spring for connecting at least two molds
KR101716882B1 Flexible semiconductor package with stress relief structure at interconnects using adhesive, and manufacturing method thereof