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FASFORD TECH CO LTD

Overview
  • Total Patents
    152
  • GoodIP Patent Rank
    9,441
  • Filing trend
    ⇩ 14.0%
About

FASFORD TECH CO LTD has a total of 152 patent applications. It decreased the IP activity by 14.0%. Its first patent ever was published in 2014. It filed its patents most often in Japan, Republic of Korea and China. Its main competitors in its focus markets semiconductors, audio-visual technology and optics are ADVANCED CHIP ENG TECH INC, STACK DEVICES CORP and ASAT LTD.

Patent filings in countries

World map showing FASFORD TECH CO LTDs patent filings in countries
# Country Total Patents
#1 Japan 59
#2 Republic of Korea 52
#3 China 39
#4 United States 2

Patent filings per year

Chart showing FASFORD TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Okamoto Naoki 41
#2 Maki Hiroshi 39
#3 Kobashi Hideharu 32
#4 Nakui Yuki 22
#5 Saito Akira 22
#6 Sakai Kazunobu 13
#7 Hiroshi Maki 10
#8 Yokomori Tsuyoshi 9
#9 Tate Mitsuaki 8
#10 Yamagami Takashi 7

Latest patents

Publication Filing date Title
KR20210033898A Die bonding apparatus and manufacturing method of semiconductor device
KR20210033896A Die bonding apparatus and method of manufacturing semiconductor device
KR20210031811A Die bonding device and method of manufacturing semiconductor device
KR20210032893A Die bonding apparatus, detaching unit, collet, and manufacturing method of semiconductor device
KR20210018031A Die bonding device and manufacturing method of semiconductor device
JP2020161534A Semiconductor manufacturing device and manufacturing method thereof
JP2020155737A Semiconductor manufacturing device and manufacturing method of semiconductor device
JP2020141114A Semiconductor manufacturing device and manufacturing method thereof
JP2020136361A Mounting device and manufacturing method of semiconductor device
JP2020047871A Semiconductor manufacturing apparatus, push-up jig and manufacturing method of semiconductor device
JP2020047841A Mounting device and manufacturing method for semiconductor device
JP2020047759A Die bonding device and manufacturing method of semiconductor device
JP2020047760A Die bonding device and semiconductor device manufacturing method
JP2020013841A Semiconductor manufacturing device and method for manufacturing semiconductor device
JP2020004812A Die bonder and manufacturing method of semiconductor device
JP2019175888A Die bonding apparatus and semiconductor device manufacturing method
JP2019165059A Die bonding apparatus and semiconductor device manufacturing method
JP2019160948A Die bonding device and manufacturing method of semiconductor device
JP2019149440A Die bonding apparatus and semiconductor device manufacturing method
JP2019145607A Mounting apparatus and method of manufacturing semiconductor device