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STACK DEVICES CORP

Overview
  • Total Patents
    24
  • GoodIP Patent Rank
    233,175
About

STACK DEVICES CORP has a total of 24 patent applications. Its first patent ever was published in 2004. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets semiconductors and audio-visual technology are ADVANCED CHIP ENG TECH INC, HONGFUJIN SHENGZHEN PREC IND C and DONGGUAN FORTUNE ELECTRONIC MATERIAL CO LTD.

Patent filings in countries

World map showing STACK DEVICES CORPs patent filings in countries
# Country Total Patents
#1 Taiwan 12
#2 United States 8
#3 China 4

Patent filings per year

Chart showing STACK DEVICES CORPs patent filings per year from 1900 to 2020

Focus industries

Focus technologies

Top inventors

# Name Total Patents
#1 Huang Chi-Pang 10
#2 Biar Jin-Chyung 4
#3 Bai Jin-Chung 4
#4 Yao Wu-Chiang 4
#5 He Mengnan 3
#6 Chou Po-Wen 3
#7 Lin Jianheng 3
#8 Cheng Ching-Shui 3
#9 He Meng-Nan 3
#10 Zhou Bo-Wen 3

Latest patents

Publication Filing date Title
US2015214416A1 Method of package for sensor chip
CN104659041A Packaging method of induction chip
TW201519334A Method of package for sensor chip
US2014170796A1 Image sensor packaging method
US2014170797A1 Sensor chip protective image sensor packaging method
CN103855066A Image induction chip packaging method for protecting chip
CN103855067A Image sensing chip packaging method
TW201419504A Encapsulation method of image sensing chips
TW201419503A Encapsulation method of image sensing chip with chip protection
TW200942463A Continuous testing or data transmission apparatus
US2005255632A1 Method of fabricating stacked semiconductor device
TWI228310B Manufacture method of stacked semiconductor device
US2005224944A1 Stacked semiconductor device
TW200532849A Stacked semiconductor device
US6900429B1 Image capture device
CN1665025A Semiconductor package capable of avoiding electromagnetic interference and making method thereof
TWI234250B Semiconductor packaging element capable of avoiding electromagnetic interference and its manufacturing method
TWI229408B Image capture device module
TWI226684B Stacked type semiconductor encapsulation device having protection mask
TW200525656A Stacked semiconductor device