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ESEC TRADING SA

Overview
  • Total Patents
    261
About

ESEC TRADING SA has a total of 261 patent applications. Its first patent ever was published in 1996. It filed its patents most often in EPO (European Patent Office), Taiwan and United States. Its main competitors in its focus markets semiconductors, machine tools and machines are ESEC TRADE AG, OERLIKON ASSEMBLY EQUIPMENT AG and ASM ASSEMBLY AUTOMATION LTD.

Patent filings per year

Chart showing ESEC TRADING SAs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Mannhart Eugen 27
#2 Schubiger Reto 22
#3 Leu Felix 19
#4 Hess Peter 18
#5 Hartmann Dominik 16
#6 Mayer Michael 15
#7 Ulrich Rene Josef 15
#8 Behler Stefan 15
#9 Zumbuehl Beat 14
#10 Thuerlemann Silvan 13

Latest patents

Publication Filing date Title
US2005029328A1 Method for checking the quality of a wedge bond
US2004245314A1 Wire bonder
TW200426972A Apparatus for mounting semiconductors
KR20040089480A Wire bonder with a device for determining the vectorial distance between the capillary and the image recognition system and method
TW200422130A Wire bonder
KR20040055575A Device for measuring the amplitude of the tip of an oscillating capillary
TW200414992A Method for picking semiconductor chips from a foil
CH696615A5 A method for adjustment of the bonding head of a die bonder.
TW200408023A Method for determining optimum bond parameters when bonding with a wire bonder
EP1492156A1 Method and pick and place system for mounting flipchips
CH696103A5 Semiconductor assembly equipment.
TW200407210A Device with an electrode for the formation of a ball at the end of a wire
TW200404026A Device with electrodes for the formation of a ball at the end of a wire
TW200402346A Clamping element with an integrated force sensor
DE10317194A1 Transport device with a gripping element for the transport of substrates
DE10310262A1 Device for the assembly of semiconductor chips
SG120915A1 Apparatus for transporting substrates in an oven
TW200304685A Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonder
CH696454A5 Semiconductor chip mounting apparatus e.g. die bonder, has sensor with two isolated coils which detects structure of substrate, to decide passage of substrate between transport systems
TW200401103A Method and device for measuring the amplitude of a freely oscillating capillary of a wire bonder