| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 22 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machine tools | |
| #3 | Machines | |
| #4 | Packaging and shipping | |
| #5 | Audio-visual technology | |
| #6 | Computer technology | |
| #7 | Measurement | |
| #8 | Mechanical elements |
| # | Name | Total Patents |
|---|---|---|
| #1 | Ueritsi Ronay Josef | 2 |
| #2 | Manhat Ougen | 1 |
| #3 | Meilze Martin | 1 |
| #4 | Manhart Yukin | 1 |
| #5 | Meyer Michael | 1 |
| #6 | Probst Oes | 1 |
| #7 | Hartman Dominek | 1 |
| #8 | Jute | 1 |
| #9 | Sutter Guido | 1 |
| #10 | Gantz Thomas | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN1435871A | Method for determining optimal bonding parameter during bonding using lead bonding device | |
| CN1436630A | Holding element for flat workpiece | |
| CN1385685A | Pressure sensor |