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ESEC SA

Overview
  • Total Patents
    117
About

ESEC SA has a total of 117 patent applications. Its first patent ever was published in 1987. It filed its patents most often in EPO (European Patent Office), United States and Singapore. Its main competitors in its focus markets semiconductors, machine tools and machines are WESTCODE SEMICONDUCTORS LTD, CHEN KUAN-NENG and MINAMIO MASANORI.

Patent filings per year

Chart showing ESEC SAs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Meisser Claudio 23
#2 Egger Hans 14
#3 Koster Christof 10
#4 Nehls Walter 8
#5 Seidel Marit 8
#6 Stoessel Zeno 8
#7 Suter Guido 8
#8 Eggenschwiler Hans 6
#9 Fluee Daniel Von 6
#10 Felber Armin 5

Latest patents

Publication Filing date Title
KR20090091157A Method and device for measuring a height difference
EP1111540A1 Method of producing a plastic object, in particular a multi media card
HK1025217A2 Apparatus and method for mounting semiconductor chips on a substrate
EP1014544A1 Electromagnetic drive device
EP1109207A1 Sucking device for holding down a substrat
SG106573A1 Electromagnetic drive device
EP1098357A1 Bond head for a wire bonder
SG74739A1 Device for the metered delivery of a viscous liquid
TW416882B Method and chip for the calibration of a wire bonder
SG71189A1 Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
TW409466B Ultrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder
TW424027B Method of making wire connections of predetermined shaped
TW403677B Dispensing nozzle for applying a viscous adhesive medium
CH689188A5 Transport installation for foil strips
EP0953398A1 Process and chip for calibrating a wire bonder
EP0928634A1 Dispensing nozzle for a die bonder
TW334622B Apparatus for making wire connections on semiconductor chips
EP0792716A1 Method for making a shaped wire connection
CH692446A5 A process for the production of workpieces and parts thereof
SG46232A1 Sensor device and position-determining method and their use for controlling a mounting robot