| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 7 | |
| #2 | Germany | 3 | |
| #3 | United Kingdom | 3 | |
| #4 | Canada | 2 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Audio-visual technology | |
| #4 | Electrical machinery and energy |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies | |
| #3 | Electric discharge tubes | |
| #4 | Advertising | |
| #5 | Casings and printed circuits |
| # | Name | Total Patents |
|---|---|---|
| #1 | Rogers Bryant C | 3 |
| #2 | Wakely Wilbur T | 3 |
| #3 | Leeds Michael T | 3 |
| #4 | Frampton Tom J | 3 |
| #5 | Rogers B | 2 |
| #6 | Frampton Thomas J | 1 |
| #7 | Wakley Wilbur T | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US5071712A | Leaded chip carrier | |
| US4651415A | Leaded chip carrier | |
| US4622433A | Ceramic package system using low temperature sealing glasses | |
| US4141712A | Manufacturing process for package for electronic devices | |
| US3840770A | Gaseous discharge display device with embedded electrode segments | |
| US3768991A | Method for sealing an enclosure for an electronic component | |
| US3697666A | Enclosure for incapsulating electronic components | |
| CA898420A | Diaphragm-connected leadless package for semiconductor devices |