Method and apparatus for mounting a piece of foil on a substrate
WO2009056468A1
Pick-up tool and method for grasping and mounting small dies
WO2009056469A1
Foil perforating needle for detaching a small die from a foil
WO2009037108A2
Pick and place system for a semiconductor assembly device
WO2008151964A1
Bonding head for a wire bonder
CH700729B1
Wire Bonder.
CN101512723A
Device for wetting bumps of a semiconductor chip with a liquid substance
CH698844B1
A device for pressing a substrate which is arranged on the semiconductor chip.
KR20090027625A
Apparatus for feeding a wire in a wire bonder, comprising a plurality of channels subjected to compressed air and lying on the arc of a circle
CH700015B1
Ultrasonic Transducer.
CH698720B1
The method and assembly machine for the assembly of semiconductor chips as a flip chip on a substrate.
CH698719B1
A method for mounting semiconductor chips on a substrate.
CH698718B1
A device for mounting a flip chip on a substrate.
CH697970B1
A process for preparing a Wedge Wedge wire bridge.
CH697827B1
Means for applying adhesive to a substrate.
CH697279B1
A method for mounting a semiconductor chip on a substrate.
EP1587138A2
Apparatus for mounting of semi-conductor chips and method for stripping of a semi-conductor chip from a film
CH697189A5
Die bonder for mounting semiconductor chips on substrate, has slide magnetically coupled to drive in drive system, to push substrates against end stop so as to align substrates parallel to end stop
CH697200A5
Clamping device and transport device for transporting substrates.
CH697278B1
Apparatus and method for the assembly or wiring of a semiconductor chip.
