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WO2007079769A1
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Tool for picking up, placing or pressing a flat object, and use of the tool
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WO2007048445A1
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Method and device for the placement of electronic components, in particular semiconductor chips, on a substrate
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WO2007042071A1
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Assembly comprising at least two components that are electrically conductively operatively connected, and method for producing the assembly
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EP1925023A1
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Method and device for depositing electronic components on a substrate
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CH697213A5
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Method and apparatus for peeling a film adhered to a flexible component.
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EP1018760A1
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Method and apparatus for encapsulating an electronic device, especially a semiconductor chip
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EP0975008A1
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Method and device for treating a flat workpiece, in particular a semiconductor wafer
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EP0883979A1
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Method and device for receiving, orientating and assembling of components
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US4974754A
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Metering apparatus for metering and delivering fluid or pasty substances and use of said metering apparatus
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US4938653A
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Transmission arrangement, in particular a maltese transmission arrangement
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