DANG BING has a total of 12 patent applications. Its first patent ever was published in 2007. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, machines and machine tools are ARAKAWA KK, ESEC SA and OERLIKON ASSEMBLY EQUIPMENT AG.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 12 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Machines | |
#3 | Machine tools | |
#4 | Measurement | |
#5 | Audio-visual technology | |
#6 | Micro-structure and nano-technology | |
#7 | Basic materials chemistry | |
#8 | Surface technology and coating |
# | Name | Total Patents |
---|---|---|
#1 | Dang Bing | 12 |
#2 | Nah Jae-Woong | 3 |
#3 | Trzcinski Robert E | 2 |
#4 | Prabhakar Aparna | 2 |
#5 | Knickerbocker John Ulrich | 2 |
#6 | Knickerbocker John | 2 |
#7 | Patel Chirag S | 2 |
#8 | Tsang Cornelia K | 2 |
#9 | Guerin Luc | 2 |
#10 | Peng Hongbo | 2 |
Publication | Filing date | Title |
---|---|---|
US2014069817A1 | Direct injection molded solder process for forming solder bumps on wafers | |
US2013330880A1 | Three dimensional flip chip system and method | |
US2013015440A1 | Integrated circuit (IC) test probe | |
US2012267729A1 | Self-sealed fluidic channels for nanopore array | |
US2011290406A1 | Laser ablation for integrated circuit fabrication | |
US2011290413A1 | Laser ablation of adhesive for integrated circuit fabrication | |
US2010326702A1 | Method for forming integrated circuit assembly | |
US2009085202A1 | Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si Interposer | |
US2009072392A1 | Techniques for forming solder bump interconnects |