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EPOCH MATERIAL CO LTD

Overview
  • Total Patents
    38
About

EPOCH MATERIAL CO LTD has a total of 38 patent applications. Its first patent ever was published in 1998. It filed its patents most often in Taiwan, Republic of Korea and China. Its main competitors in its focus markets basic materials chemistry, semiconductors and optics are ANJI MICROELECTRONICS SHANGHAI, ANJI MICROELECTRONICS CO LTD and KAMIMURA TETSUYA.

Patent filings in countries

World map showing EPOCH MATERIAL CO LTDs patent filings in countries

Patent filings per year

Chart showing EPOCH MATERIAL CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Liu Wen Cheng 16
#2 Liu Wen-Cheng 7
#3 Lee Kang Hua 7
#4 Chen Chien Ching 7
#5 Huo Teng Yan 5
#6 Lee Tsung-Ho 4
#7 Shiue Jing Chiuan 3
#8 Wenzheng Liu 3
#9 Tsai Wang Hang 3
#10 Lee Kang-Hua 3

Latest patents

Publication Filing date Title
TW201418450A Aqueous cleaning composition for post chemical mechanical planarization
TW201239053A Polishing composition for polishing through-silicon via (tsv) wafer and use of the same
KR20110031073A Method for polishing semiconductor wafers having through-silicon via structure and polishing composition for its use
TW201042017A Chemical mechanical polishing composition for removing saw mark
CN101735730A Composition and method for chemical mechanical polishing
TW201018720A Chemical mechanical polishing composition and method
CN101637884A Method for grinding through-silicon vias wafer and grinding component used by same
TW201003759A Method for polishing through-silicon via wafers and polishing composition used therein
TW200927919A Aqueous cleaning composition
TW200907047A Aqueous cleaning composition for semiconductor copper processing
US2007290165A1 Chemical mechanical polishing composition
TW200736372A Chemical mechanical polishing composition
TW200728453A Composition for washing polishing pad for chemical mechanical polishing
KR100747677B1 Homogenizer
CN1966635A Aqueous alkaline photoresist cleaning composition and method of use
TW200719098A Aqueous alkaline photoresist cleaning composition and method using the same
TWI268177B Swing mixing device
TW200641121A Aqueous cleaning composition for semiconductor copper processing
TWI266798B Aqueous cleaning composition for post chemical mechanical planarization
TWI272294B Composition and method for producing composite abrasive