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ANJI MICROELECTRONICS SHANGHAI

Overview
  • Total Patents
    310
  • GoodIP Patent Rank
    127,214
About

ANJI MICROELECTRONICS SHANGHAI has a total of 310 patent applications. Its first patent ever was published in 2005. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets basic materials chemistry, semiconductors and optics are ANJI MICROELECTRONICS CO LTD, EPOCH MATERIAL CO LTD and KAMIMURA TETSUYA.

Patent filings in countries

World map showing ANJI MICROELECTRONICS SHANGHAIs patent filings in countries

Patent filings per year

Chart showing ANJI MICROELECTRONICS SHANGHAIs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Jing Jianfen 47
#2 Wang Chen 36
#3 Liu Bing 36
#4 He Huafeng 34
#5 Cai Xinyuan 32
#6 Peng Libbert Hongxiu 32
#7 Zhang Jian 31
#8 Jing Judy Jianfen 31
#9 Yao Ying 29
#10 Wang Yuchun 27

Latest patents

Publication Filing date Title
TW201623556A Application of azole compound in chemical mechanical polishing slurry for stability improvement
TW201623555A Chemical mechanical polishing slurry and its application
TW201623554A Application of composition for polishing the barrier layer
TW201623558A Chemical mechanical polishing liquid and application thereof
TW201623557A Chemical mechanical polishing slurry and application thereof
CN104745094A Chemically mechanical polishing liquid
CN104745091A Chemical mechanical polishing liquid and use method thereof
CN104745145A Preparation method and use of modified silica particles
CN104745093A Chemical mechanical polishing liquid
CN104745092A Chemical mechanical polishing liquid used in STI field, and use method thereof
CN104745083A Chemical mechanical polishing liquid and polishing method
CN104745086A Chemical mechanical polishing solution for barrier layer planarization, and use method thereof
CN104745085A Chemical mechanical polishing solution for cobalt barrier layer polishing
CN104745084A Chemical mechanical solution for aluminum, and use method thereof
CN104745089A Chemically mechanical polishing liquid for flattening barrier layer and use method thereof
CN104745088A Chemical mechanical polishing solution for barrier layer planarization, and use method thereof
CN104745082A Chemical mechanical polishing liquid and polishing method
CN104745087A Chemical mechanical polishing solution and polishing method
CN104745090A Chemically mechanical polishing liquid and application thereof
CN104733305A Low dielectric material restoration method