Method and composition for selectively removing metal hardmask and other residues from semiconductor device substrates comprising low-k dielectric material and copper
TW201420751A
A cleaning composition and method for cleaning a semiconductor device substrate after chemical mechanical polishing
US2013237469A1
Aluminum post-etch residue removal with simultaneous surface passivation
US2013157472A1
Method and composition for removing resist, etch residue, and copper oxide from substrates having copper, metal hardmask and low-k dielectric material
EP2748296A2
Composition for cleaning substrates post-chemical mechanical polishing
US2009281017A1
Cleaning composition comprising a chelant and quaternary ammonium hydroxide mixture
US2009203566A1
Semiconductor process residue removal composition and process
EP2207872A1
Novel nitrile and amidoxime compounds and methods of preparation
