CN112185987A
|
|
Packaging structure and method of biological identification fingerprint chip
|
CN111900181A
|
|
Wafer level packaging method for image sensing chip
|
CN111668321A
|
|
Packaging structure and method of biological identification fingerprint chip
|
CN111508988A
|
|
Chip packaging structure and packaging method
|
CN111477619A
|
|
Chip packaging structure and packaging method
|
CN111276452A
|
|
Chip packaging structure and packaging method thereof
|
CN111276451A
|
|
Chip packaging structure, packaging assembly and packaging method
|
CN111370375A
|
|
Packaging structure, semiconductor device and packaging method
|
CN111192931A
|
|
Packaging structure and method of fingerprint identification chip
|
CN111192941A
|
|
Packaging structure and method of fingerprint identification chip
|
CN111370434A
|
|
Packaging structure and packaging method
|
CN110993495A
|
|
Chip preparation method and wafer level packaging chip
|
CN110867432A
|
|
Chip packaging structure and packaging method
|
CN110970454A
|
|
Packaging structure of biological characteristic recognition chip
|
US2019202685A1
|
|
Chip package and chip packaging method
|
US2019188447A1
|
|
Optical fingerprint recognition chip package and packaging method
|
US2019189578A1
|
|
Fingerprint chip packaging method and fingerprint chip package
|
US2019206801A1
|
|
Semiconductor device and manufacture method of the same
|
US2019165013A1
|
|
Package for iris recognition imaging module and manufacturing method thereof
|
US2019165030A1
|
|
Image sensing chip package and image sensing chip packaging method
|