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CHINA WAFER LEVEL CSP CO LTD

Overview
  • Total Patents
    299
  • GoodIP Patent Rank
    5,383
  • Filing trend
    ⇧ 8.0%
About

CHINA WAFER LEVEL CSP CO LTD has a total of 299 patent applications. It increased the IP activity by 8.0%. Its first patent ever was published in 2011. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets semiconductors, computer technology and micro-structure and nano-technology are SHANDONG YANDING ELECTRONIC TECH CO LTD, ZOWIE TECHNOLOGY CORP and SMIC CHANGJIANG SEMICONDUCTOR (JIANGYIN) CO LTD.

Patent filings in countries

World map showing CHINA WAFER LEVEL CSP CO LTDs patent filings in countries

Patent filings per year

Chart showing CHINA WAFER LEVEL CSP CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Zhiqi 259
#2 Yu Qiong 87
#3 Wang Wei 57
#4 Xie Guoliang 53
#5 Wang Yu 44
#6 Yang Ying 28
#7 Shen Zhijie 24
#8 Wang Zhuowei 21
#9 Hu Hanqing 20
#10 Wu Mingxuan 14

Latest patents

Publication Filing date Title
CN112185987A Packaging structure and method of biological identification fingerprint chip
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CN111668321A Packaging structure and method of biological identification fingerprint chip
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CN111192931A Packaging structure and method of fingerprint identification chip
CN111192941A Packaging structure and method of fingerprint identification chip
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CN110993495A Chip preparation method and wafer level packaging chip
CN110867432A Chip packaging structure and packaging method
CN110970454A Packaging structure of biological characteristic recognition chip
US2019202685A1 Chip package and chip packaging method
US2019188447A1 Optical fingerprint recognition chip package and packaging method
US2019189578A1 Fingerprint chip packaging method and fingerprint chip package
US2019206801A1 Semiconductor device and manufacture method of the same
US2019165013A1 Package for iris recognition imaging module and manufacturing method thereof
US2019165030A1 Image sensing chip package and image sensing chip packaging method