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SIGNETICS KOREA CO LTD

Overview
  • Total Patents
    27
  • GoodIP Patent Rank
    97,236
  • Filing trend
    ⇩ 100.0%
About

SIGNETICS KOREA CO LTD has a total of 27 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2002. It filed its patents most often in Republic of Korea and United States. Its main competitors in its focus markets semiconductors, computer technology and medical technology are SHANDONG YANDING ELECTRONIC TECH CO LTD, ZOWIE TECHNOLOGY CORP and CHINA WAFER LEVEL CSP CO LTD.

Patent filings in countries

World map showing SIGNETICS KOREA CO LTDs patent filings in countries
# Country Total Patents
#1 Republic of Korea 25
#2 United States 2

Patent filings per year

Chart showing SIGNETICS KOREA CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Chang Young 5
#2 Seo Dae Seong 3
#3 Yee Hyo Jae 3
#4 Baik Dong Won 2
#5 Boo Kyung Teck 2
#6 Kim Myun Soo 2
#7 Mok Jin Tak 2
#8 Seo Dae Sung 2
#9 Kang In Joong 2
#10 Lee Sang Hoon 1

Latest patents

Publication Filing date Title
KR102163694B1 Fingerprint recognition sensor package
KR101809004B1 Fingerprint recognition sensor package, and PCB(printed circuit board) strip package structure comprising the same package
KR20180106737A Fingerprint recognition sensor package
KR20170126332A Fingerprint recognition sensor package comprising flexible printed circuit board
KR20170126336A Fingerprint recognition sensor package and method of manufacturing the same
KR20170126330A Fingerprint recognition sensor package comprising flexible printed circuit board
KR20170126337A Fingerprint recognition sensor package and method of manufacturing the same
KR20170126335A Fingerprint recognition sensor package comprising flexible printed circuit board
KR20170085676A Semiconductor package
KR20170084852A Apparatus for molding chip
KR20170084857A Apparatus for molding chip
KR20170084937A Station block
KR20170084941A Fingerprint sensor package and method for manufacturing the same
KR20170084859A Chip molding device
KR20170084865A Apparatus for molding chip
KR20170084940A Semiconductor package
KR20170084938A Peek for molding process
KR101459566B1 Heatslug, semiconductor package comprising the same heatslug, and method for fabricating the same semiconductor package
KR20140074079A QFN package inproving a solder joint ability and the method thereof
KR20140032585A Pbga package having a reinforcement resin