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SHANDONG YANDING ELECTRONIC TECH CO LTD

Overview
  • Total Patents
    19
  • GoodIP Patent Rank
    88,384
About

SHANDONG YANDING ELECTRONIC TECH CO LTD has a total of 19 patent applications. Its first patent ever was published in 2019. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, computer technology and audio-visual technology are CHINA WAFER LEVEL CSP CO LTD, ZOWIE TECHNOLOGY CORP and SMIC CHANGJIANG SEMICONDUCTOR (JIANGYIN) CO LTD.

Patent filings in countries

World map showing SHANDONG YANDING ELECTRONIC TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 19

Patent filings per year

Chart showing SHANDONG YANDING ELECTRONIC TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hou Hongwei 19

Latest patents

Publication Filing date Title
CN111952202A Packaging structure of fingerprint identification sensor and forming method thereof
CN111952203A Fingerprint identification package and forming method thereof
CN111799236A Chip packaging structure and packaging method for integrated passive element
CN111968530A Optoelectronic component and method for producing an optoelectronic component
CN111816642A Anti-static sensor
CN111816643A Touch sensor
CN111524813A Biological identification packaging structure and forming method thereof
CN111508849A Fingerprint identification device and manufacturing method thereof
CN111508850A Intelligent chip packaging structure and manufacturing method thereof
CN111384077A Semiconductor sensor package and method of forming the same
CN111370436A Sensor packaging structure and preparation method thereof
CN111341798A Sensing device and packaging method thereof
CN111384076A Sensor structure and forming method thereof
CN110993789A Fan-out type semiconductor packaging structure
CN111048485A Semiconductor chip device
CN110943041A Semiconductor structure with side surface led out, manufacturing method thereof and stacking structure
CN111106078A Multi-chip integrated packaging structure
CN110610952A Image sensor device and manufacturing method thereof
CN110610953A Camera sensing assembly and manufacturing method thereof