| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 11 | |
| #2 | EPO (European Patent Office) | 2 | |
| #3 | WIPO (World Intellectual Property Organization) | 2 | |
| #4 | Germany | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Computer technology | |
| #3 | Optics | |
| #4 | Chemical engineering |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Data recognition and presentation | |
| #3 | Drying solid materials by removing liquid | |
| #4 | Optical systems |
| # | Name | Total Patents |
|---|---|---|
| #1 | Zakel Elke | 13 |
| #2 | Azdasht Ghassem | 9 |
| #3 | Aschenbrenner Rolf | 5 |
| #4 | Kasulke Paul | 4 |
| #5 | Lange Martin | 3 |
| #6 | Teutsch Thorsten | 3 |
| #7 | Ansorge Frank | 3 |
| #8 | Oppermann Hans-Hermann | 1 |
| #9 | Teulsch Thorsten | 1 |
| #10 | Ostmann Andreas | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2011057312A1 | Terminal face contact structure and method of making same | |
| US6651891B1 | Method for producing contactless chip cards and corresponding contactless chip card | |
| WO9923606A1 | Method for producing contactless chip cards and corresponding contactless chip card | |
| DE19639902A1 | Process for the production of contactless chip cards and contactless chip card | |
| US5989993A | Method for galvanic forming of bonding pads |