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STATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD

Overview
  • Total Patents
    13
  • GoodIP Patent Rank
    134,782
About

STATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD has a total of 13 patent applications. Its first patent ever was published in 2018. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, computer technology and measurement are CHINA WAFER LEVEL CSP CO LTD, ZAKEL ELKE and SHANDONG YANDING ELECTRONIC TECH CO LTD.

Patent filings in countries

World map showing STATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTDs patent filings in countries
# Country Total Patents
#1 China 13

Patent filings per year

Chart showing STATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTDs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Shen Guoqiang 8
#2 Liu Renqi 6
#3 Bao Xusheng 5
#4 Sun Xiaofei 4
#5 Min Jiongyi 3
#6 Jin Zhenghan 3
#7 Zhou Kaixuan 3
#8 Xu Jian 3
#9 Hua Yingfeng 3
#10 Chen Ming 3

Latest patents

Publication Filing date Title
CN111900142A Chip packaging structure and packaging method thereof
CN111415891A Chip gland jig and technological method thereof
CN110600408A Cleaning clamp for chip mounting substrate and using method thereof
CN110459495A It is a kind of for correcting the jig and its application method of the warpage of tail product
CN110349945A A kind of encapsulating structure and its packaging method of multi-chip
CN110085580A A kind of chip-packaging structure and its packaging method being implanted into damper
CN110031749A A kind of substrate layer aligns test-strips and its monitoring method partially
CN109273425A A kind of wiring method of lead-frame packages structure
CN108734156A A kind of packaging method and its encapsulating structure of ultra-thin fingerprint recognition chip
CN108734154A A kind of packaging method and its encapsulating structure of ultra-thin fingerprint recognition chip
CN109037083A A kind of packaging method of QFN fingerprint recognition chip
CN108734155A A kind of packaging method and its encapsulating structure of ultra-thin fingerprint recognition chip
CN109037084A A kind of packaging method of QFN fingerprint recognition chip