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BEIJING U PRECISIUM TECH CO LTD

Overview
  • Total Patents
    39
  • GoodIP Patent Rank
    39,255
About

BEIJING U PRECISIUM TECH CO LTD has a total of 39 patent applications. Its first patent ever was published in 2016. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, optics and machine tools are BEAM CORP E, SEMICON TECH GLOBAL LTD and BLATCHFORD JAMES WALTER.

Patent filings in countries

World map showing BEIJING U PRECISIUM TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 39

Patent filings per year

Chart showing BEIJING U PRECISIUM TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yang Pengyuan 12
#2 Tang Nana 12
#3 Hou Zhanjie 12
#4 Wang Jianchong 12
#5 Han Weiqi 11
#6 Li Yuancheng 9
#7 Zhu Yu 9
#8 Zhang Yuli 9
#9 Rong Jiping 8
#10 Liu Xiaoyan 7

Latest patents

Publication Filing date Title
CN112271053A Gravity compensation device
CN112099121A Scanning interference photoetching system based on 4f system
CN112151435A Silicon chip adsorption unit and silicon chip transmission device
CN112053938A Wafer bonding method
CN112053975A Bonding disc for wafer bonding and wafer bonding device
CN111916345A Wafer bonding method and device
CN112071781A Bonding-releasing device and method
CN112053939A Wafer bonding method
CN112053985A Wafer alignment device and alignment method thereof
CN111916346A Wafer low-temperature bonding system and bonding method
CN112053940A Device and method for compensating wedge error in wafer bonding
CN111958102A Moving type laser processing environment control chamber system
CN111863693A Electrostatic chuck and preparation method thereof
CN111796489A Mask alignment photoetching machine based on UV-LED (ultraviolet-light emitting diode) area array type light source
CN111796490A Scanning type exposure method based on UV-LED photoetching light source
CN111796487A Maskless scanning exposure method based on UV-LED photoetching light source and photoetching machine
CN111880380A Maskless exposure method based on digital microlens array and photoetching machine
CN111796488A Stepping exposure method based on UV-LED photoetching light source
CN111668092A Wafer bonding method
CN111036616A Device and method for removing particles on surface of wafer