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BARUN ELECTRONICS CO LTD

Overview
  • Total Patents
    67
  • GoodIP Patent Rank
    46,242
  • Filing trend
    ⇧ 40.0%
About

BARUN ELECTRONICS CO LTD has a total of 67 patent applications. It increased the IP activity by 40.0%. Its first patent ever was published in 1998. It filed its patents most often in Republic of Korea, China and Taiwan. Its main competitors in its focus markets semiconductors, computer technology and audio-visual technology are CHIN MEITO, BARTLEY GERALD K and LEE HO-JIN.

Patent filings per year

Chart showing BARUN ELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Choi Wan Gyun 10
#2 Oh Sang Eon 6
#3 Jeong Dae Seon 5
#4 Park Sang Yeong 5
#5 Lee Jae Hyun 5
#6 Kim Young Hoon 5
#7 Lim Min Bin 4
#8 Jung Do Su 4
#9 Ahn Min Cheol 4
#10 Kim Seung Hyun 3

Latest patents

Publication Filing date Title
KR20200077265A Composite pcb package for radiation heat and method for manufacturing
KR20200032360A Semiconductor package and method for manufacturing the same
TW201844076A Method for manufacturing semiconductor component which involves molding an EMI mask substance on the semiconductor component during its manufacturing process
KR20190094983A Manufacturing method of qfn semiconductor package
KR20190080246A Method for manufacturing semiconductor device
KR20190014865A Method for manufacturing semiconductor device
KR20190012996A Wafer chip dicing method
KR20180051192A Color-varied memory device
KR20180020516A Contact resistance-type foot pressure sensor
WO2017026861A1 Memory card of which color varies according to temperature
KR101781799B1 Chip stacking method for preventing chip bending and semiconductor package manufactured using the same
KR20170127738A Beacon device having multi-sensors
KR20170122040A Relay node of mesh network and relay processing method
KR20170053074A Control system of the image data stored in the memory card
KR20170050372A Stacked semiconductor packages
KR20160128684A Multi die stacking method using Printed Circuit Board and semiconductor package employing it
KR101621691B1 Identifier setting method of the beacon device
KR101547465B1 Multi embedded multimedia card
KR20150112627A Only read alarm method of the data storage device with a memory chip
TW201503307A Die stacking method and semiconductor package employing it